JPH0751221Y2 - 真空チャック - Google Patents
真空チャックInfo
- Publication number
- JPH0751221Y2 JPH0751221Y2 JP8205090U JP8205090U JPH0751221Y2 JP H0751221 Y2 JPH0751221 Y2 JP H0751221Y2 JP 8205090 U JP8205090 U JP 8205090U JP 8205090 U JP8205090 U JP 8205090U JP H0751221 Y2 JPH0751221 Y2 JP H0751221Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- conductive
- vacuum chuck
- conductive member
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 37
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 238000001179 sorption measurement Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000221535 Pucciniales Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8205090U JPH0751221Y2 (ja) | 1990-07-31 | 1990-07-31 | 真空チャック |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8205090U JPH0751221Y2 (ja) | 1990-07-31 | 1990-07-31 | 真空チャック |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0442343U JPH0442343U (en]) | 1992-04-10 |
JPH0751221Y2 true JPH0751221Y2 (ja) | 1995-11-22 |
Family
ID=31628523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8205090U Expired - Lifetime JPH0751221Y2 (ja) | 1990-07-31 | 1990-07-31 | 真空チャック |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0751221Y2 (en]) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002025947A (ja) * | 2000-07-10 | 2002-01-25 | Dowa Mining Co Ltd | 半導体素子の製造方法 |
KR100709776B1 (ko) * | 1999-05-21 | 2007-04-19 | 가부시키가이샤 브리지스톤 | 제품 홀더 |
KR20140055984A (ko) * | 2012-10-31 | 2014-05-09 | 가부시기가이샤 디스코 | 가공 장치 |
JP2015162555A (ja) * | 2014-02-27 | 2015-09-07 | 株式会社ディスコ | 切削装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06143073A (ja) * | 1992-10-27 | 1994-05-24 | Sony Corp | バキュームチャックプレート |
JP2010184331A (ja) * | 2009-02-13 | 2010-08-26 | Disco Abrasive Syst Ltd | 保持テーブルおよび加工装置 |
JP5378089B2 (ja) * | 2009-07-16 | 2013-12-25 | 株式会社ディスコ | 保護テープ剥離装置 |
JP5340841B2 (ja) * | 2009-07-21 | 2013-11-13 | 株式会社ディスコ | 切削装置 |
WO2025105097A1 (ja) * | 2023-11-17 | 2025-05-22 | 住友重機械工業株式会社 | レーザ処理装置、レーザアニール装置 |
-
1990
- 1990-07-31 JP JP8205090U patent/JPH0751221Y2/ja not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100709776B1 (ko) * | 1999-05-21 | 2007-04-19 | 가부시키가이샤 브리지스톤 | 제품 홀더 |
JP2002025947A (ja) * | 2000-07-10 | 2002-01-25 | Dowa Mining Co Ltd | 半導体素子の製造方法 |
KR20140055984A (ko) * | 2012-10-31 | 2014-05-09 | 가부시기가이샤 디스코 | 가공 장치 |
JP2014090105A (ja) * | 2012-10-31 | 2014-05-15 | Disco Abrasive Syst Ltd | 加工装置 |
JP2015162555A (ja) * | 2014-02-27 | 2015-09-07 | 株式会社ディスコ | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0442343U (en]) | 1992-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |